- Project number:
- STU Stevek 2
- Title of the project:
- Improved Slotting in IC automation design
- Project type:
- Other projects
- Project duration (start):
- Project duration (end):
Grant: Internal Grant of the Slovak University of Technology in Bratislava
Abstract: In this project we address slotting problem in integrated circuit automation design for top-layer metals.
An integrating circuit production technology consists of many
manufacturing steps - optical exposure, resist development, chemical
vapor deposition and chemical-mechanical polishing (CMP) - have
different influences on local characteristics of the layout. To keep
these effects uniform and predictable the layout must be made uniform to
certain density parameters. It is possible to achieve this uniformity
by insertion (filling) or partial deletion (slotting) of shapes in a
We propose to design slotting algorithm by means of multi-parametric
programming. We focus on optimization problem for convex shapes of metal
layers. Constraints of the problem will reflect restrictions of the
production technology and limitation of the implementation
environment. The solution should exhibit simple implementation and
guarantees results in a real-time.
Objectives: A challenge is to design a slotting algorithm that
offers solutions in a real time while satisfying all technology
restrictions. Moreover algorithm has to respect limits of an
implementation scripting language.
- complexity reduction
- use of optimization approaches for simplifying multi-parametric solution that were developed within project VEGA 1/0095/11
Principal researcher: Juraj Števek
- J. Števek – M. Kvasnica – M. Fikar – A. Vrbický: An Application of Multi-parametric Programming in Integrated Circuit Automation (Slotting Problem). In Preprints of the 19th IFAC World Congress Cape Town (South Africa) August 24 - August 29, 2014, pp. 10275–10280, 2014.